Amkor Technology, Inc. - Amkor's #FlipChip BGA (#FCBGA) is the packaging solution for your next #computing/ #networking, consumer, #communications, or #automotive application. Our FCBGAs bring fast performance with memory close to the #
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![Amkor Technology on Twitter: "Amkor's MLF®/ #QFN packaging #technology is one of the fastest-growing #ICpackaging solutions today. To learn more and to download the #datasheet, visit https://t.co/HU94K0ozft #semiconductor #leadframe #advancedpackaging ... Amkor Technology on Twitter: "Amkor's MLF®/ #QFN packaging #technology is one of the fastest-growing #ICpackaging solutions today. To learn more and to download the #datasheet, visit https://t.co/HU94K0ozft #semiconductor #leadframe #advancedpackaging ...](https://pbs.twimg.com/media/FTgTfMvUUAAYFtl.jpg:large)